Smart optical measurement probe for autonomously detecting nano-defects on bare semiconductor wafer surface: Verification of proposed concept

We propose a new method of inspecting a surface for fine defects that combines the optical inspection method with observation of the physical behavior of a liquid. A liquid thin film on a substrate behaves as a near-field physical probe that autonomously captures nano-particulate defects. Optical observation of the interfacial behavior of the liquid thin film is used to detect minute defects. This method combines the characteristics of optical detection (i.e., detection from a remote field and simultaneous detectability on a plane) and the high sensitivity of a physical near-field probe. We examined the basic principles of the proposed method through numerical calculation and applied it in experiments to detect fine particulate defects on a silicon substrate for semiconductor manufacturing to demonstrate the validity of the basic concept of the proposed method.     

Effect of interfacial friction force on material removal in full aperture continuous polishing process

Full aperture continuous polishing using pitch lap is a key process of finishing large flat optical workpiece. The friction force of the workpiece and pitch lap interface significantly affects material removal. In this work, the friction force was determined by a measurement system that uses force transducers to support the workpiece. Experimental and theoretical analyses have been carried out to investigate the evolution of friction force with polishing time and its effect on material removal. Our results show that the friction coefficient of the workpiece/lap interface decreases during polishing, which is due to surface smoothing of the viscoelastic pitch lap by loading conditioner. In addition, the spatial average and uniformity of material removal rate (removal coefficient) increases with the increase of friction coefficient, which is due to rough lap surface, provides more sharp asperities to charge the polishing particles.     

Effect of grinding-induced cyclic heating on the hardened layer generation in the plunge grinding of a cylindrical component

This paper discusses the effects of the grinding-induced cyclic heating on the properties of the hardened layer in a plunge cylindrical grinding process on the high strength steel EN26. It was found that a multi-pass grinding brings about a uniform and continuous hardened layer along the circumference of the cylindrical workpiece. An increase of the number of grinding passes, leads to a thicker layer of hardening, a larger compressive residual stress and a deeper plastic deformation zone. Within the plastic deformation zone, the martensitic grains are refined by the thermo-mechanical loading, giving rise to a hardness of 12.5% higher than that from a conventional martensitic transformation. The coupled effects of heat accumulation and wheel wear in the multi-pass grinding are the main causes for the thickening of the hardened layer. A too small infeed per workpiece revolution would result in insufficient grinding heat, and in turn, bring about an undesirable tempered hardened layer and a reduction of its hardness.     

一种基于等效平行间隙的静密封漏率预测方法

工程中由于密封件形状多样化和表面接触压力复杂多变,现有分析方法难以快速对密封性能进行定量分析。提出一种将密封接触压力引起的粗糙表面泄漏间隙变化等效为平行泄漏间隙,进而采用可压缩雷诺方程进行漏率计算的方法。该方法可快速计算各种工况下的密封性能。通过设计测量漏率实验,标定出接触压力和泄漏间隙的关系。基于该关系,将由有限元模型计算得到的密封接触压力分布转变为等效平行泄漏间隙分布,进而通过雷诺方程计算出密封界面的漏率。通过D形截面垫片验证漏率预测方法的准确性,实验验证表明,该方法能够快速准确计算出不均匀密封接触压力表面的漏率。     

直接激光沉积Al2O3增强NiCrAlY涂层的微观组织及力学性能

目的改善NiCrAlY涂层微观组织并提高其力学性能。方法采用直接激光沉积方法制备100%NiCrAlY、NiCrAlY+10%Al_2O_3和Ni CrAlY+20%Al_2O_3三种样件,分别利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、X射线能量色散谱仪(EDS)、电子探针X射线显微分析仪(EPMA),对不同成分样件进行相组成分析、微观组织观察以及元素组成检测,使用维式显微硬度测试计和万能摩擦磨损试验机,分别检测各个涂层的显微硬度和摩擦系数。结果在NiCrAlY中添加Al_2O_3后,Al_2O_3以不规则形状或球形分布在晶内或者晶界处,其尺寸小于2μm。三种复合涂层样件均由γ-Ni和β-NiAl相组成,添加Al_2O_3陶瓷颗粒后,涂层一次枝晶臂间距均减小,且Ni-Y相显著减少,Y2O3陶瓷颗粒弥散分布在基体的晶内与晶界处。NiCrAlY、NiCrAlY+10%Al_2O_3和NiCrAlY+20%Al_2O_3涂层的平均硬度分别为(440.69±30)HV0.2、(482.18±30)HV0.2和(453.09±20)HV0.2,100%NiCrAlY、NiCrAlY+10%Al_2O_3和NiCrAlY+20%Al_2O_3涂层的摩擦系数分别为0.77、0.55和0.52。结论加入Al_2O_3后,基体晶粒有一定程度的细化。在晶粒细化作用以及陶瓷颗粒弥散作用下,涂层的显微硬度有所提高,其中NiCrAlY+10%Al_2O_3的硬度最高,相比NiCrAlY基体提高了约9.5%。此外,发现添加Al_2O_3后,NiCrAlY+10%Al_2O_3和NiCrAlY+20%Al_2O_3样件的摩擦系数比NiCrAlY样件下降均超过25%,其中NiCrAlY+10%Al_2O_3样件的磨损量最小,相对于NiCrAlY涂层下降了近13.5%,耐磨性明显改善。     

Compression properties of gas diffusion layers and its constitutive model under cyclic loading

The compressive deformation of gas diffusion layer (GDL), which is highly nonlinear and related to the loading history, affects the performance of PEM fuel cell stacks. However, linear elastic models are widely used. In this study, a new nonlinear constitutive model is proposed to describe the compression properties. Macroscopic studies reveal that GDL has different mechanical properties during the first and repeated compression stages. Besides, the tangent modulus has a significant linear relationship with stress. The constitutive model can be rebuilt using the micro-mechanical theory of fiber assemblies by considering the bending of carbon fibers. Furthermore, a prediction method is proposed to describe cyclic compression behavior. The prediction results fit well with the test results with an average and maximum relative error of less than 5.30% and 18.13%, respectively. These conclusions are beneficial to the design of GDL with specific mechanical properties and the real-time analysis of PEM fuel cell.     

化学机械抛光液的研究进展

化学机械抛光（CMP）技术是集成电路制造中获得全局平坦化的一种重要手段,化学机械抛光液是影响抛光质量和抛光效率的关键因素之一,而抛光液中的磨粒和氧化剂决定了抛光液的各项化学机械抛光性能。将抛光液磨粒分为单一磨粒、混合磨粒以及复合磨粒,综述了近年来国内外化学机械抛光液磨粒发展现状,其中重点分析和总结了SiO2、Al2O3、CeO2三种单一磨粒,SiO2/Al2O3、SiO2/SiO2、SiO2/CeO2混合磨粒,CeO2@SiO2、PS@CeO2、PS@SiO2、sSiO2@mSiO2、PMMA@CeO2、PS@mSiO2等核-壳结构复合磨粒,Co、Cu、Fe、Ce、La、Zn、Mg、Ti、Nd等离子掺杂复合磨粒的研究和应用现状,并针对目前存在的问题进行了详细的分析。针对目前化学机械抛光液不同材料氧化剂（高锰酸钾和过氧化氢）的选择和使用进行了分析总结。此外,介绍了一种新型绿色环保抛光液的研究和使用情况,同时对化学机械抛光液存在的共性问题进行了总结,最后展望了化学机械抛光液未来的研究方向。     

在金属基底上制作高深宽比金属微光栅的方法

根据光学领域对高深宽比金属微器件的需求,利用UV-LIGA工艺在金属基底上制作了具有高深宽比的金属微光栅。采用分层曝光、一次显影的方法制作了微电铸用SU-8胶厚胶胶模,解决了高深宽比厚胶胶模制作困难的问题。由于电铸时间长易导致铸层缺陷,故采取分次电铸等措施得到了电铸光栅结构;同时通过线宽补偿的方法解决了溶胀引起的线宽变小问题。在去胶工序中,采用"超声-浸泡-超声"循环往复的方法。最终,制作了周期为130μm、凸台长宽高为900μm×65μm×243μm的金属微光栅,其深宽比达到5,尺寸相对误差小于1%,表面粗糙度小于6.17nm。本文提出的工艺方法克服了现有方法制作金属微光栅时高度有限、基底易碎等局限性,为在金属基底上制作高深宽比金属微光栅提供了一种可行的工艺参考方案。     

金属基体超疏水表面制备及应用的研究进展

在介绍润湿性相关理论的基础上,综述了国内外金属基体超疏水表面的制备方法及应用,重点讨论了阳极氧化法、电化学沉积法、化学腐蚀法、化学沉积法、一步浸泡法、热氧化法、模板法、复合法等,及超疏水表面在响应开关、自清洁、流体减阻、耐腐蚀、防冰霜、油水分离、微型水上运输器等方面的应用,最后评述了各种方法的特点,提出了在金属基体上制...     

Fabrication of Fuze Micro-electro-mechanical System Safety Device

Fuze micro-electro-mechanical system(MEMS) has become a popular subject in recent years.Studies have been done for the application of MEMS-based fuze safety and arm devices.The existing researches mainly focused on reducing the cost and volume of the fuze safety device.The reduction in volume allows more payload and,thus,makes small-caliber rounds more effective and the weapon system more affordable.At present,MEMS-based fuze safety devices are fabricated mainly by using deep reactive ion ething or LIGA technology,and the fabrication process research on the fuze MEMS safety device is in the exploring stage.In this paper,a new micro fabrication method of metal-based fuze MEMS safety device is presented based on ultra violet(UV)-LIGA technology.The method consists of SU-8 thick photoresist lithography process,micro electroforming process,no back plate growing process,and SU-8 photoresist sacrificial layer process.Three kinds of double-layer moveable metal devices have been fabricated on metal substrates directly with the method.Because UV-LIGA technology and no back plate growing technology are introduced,the production cycle is shortened and the cost is reduced.The smallest dimension of the devices is 40 μm,which meets the requirement of size.To evaluate the adhesion property between electroforming deposit layer and substrate qualitatively,the impact experiments have been done on the device samples.The experimental result shows that the samples are still in good condition and workable after undergoing impact pulses with 20 kg peak and 150 μs duration and completely met the requirement of strength.The presented fabrication method provides a new option for the development of MEMS fuze and is helpful for the fabrication of similar kinds of micro devices.